EE569 IPC Practice Test

Session length

1 / 20

Which two standards are typically used on the assembly and soldering floor?

IPC-6012 and IPC-2221

IPC-A-610 and IPC-7093

The correct answer involves IPC-A-610 and IPC-7093, which are standards focused specifically on the assembly and soldering processes in electronic manufacturing. IPC-A-610 provides criteria for the acceptance of electronic assembly, detailing the quality that should be observed for various components and assemblies. This standard ensures that products are built to consistently high levels of quality, incorporating requirements for printed circuit board (PCB) assembly, soldering conditions, and component orientation.

IPC-7093 relates to the design and assembly of advanced packaging and heterogeneous integration, supporting the modern practices associated with higher complexity in electronic assemblies. This standard is essential for guiding manufacturers in achieving reliable soldering practices in complex assemblies, thereby ensuring performance and reliability.

Together, these standards are pivotal in establishing protocols that defiantly aim for quality and reliability in electronic manufacturing, particularly with soldering processes and assembly criteria, making them the primary references on the assembly and soldering floor. The context of other choices can involve standards that relate more to design and documentation rather than direct assembly and soldering activities, indicating that B encompasses the most relevant standards for the specified question about assembly and soldering floors.

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IPC-CH-65 and IPC-CC-830

IPC-2581 and IPC-4562A

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